Heat Sink Compound Types

Type z9 1 fluid ounce.

Heat sink compound types.

4 7 out of 5 stars 26. Temperature range from 45 degrees f to 500 degrees f. Bond heat sinks to surfaces eliminating air gaps for maximum heat transfer. Will not harden or melt.

1446622 silicone heat sink compound lubricant grease 5 oz 140 g tube. Type z9 1 fluid ounce. Will not react to rubber or plastic. Super lube silicone heat sink 3 oz.

More buying choices 32 99 8 new offers thermal paste 5 pack thermalcoolflux tm high performance polysynthetic silver thermal paste. Thermal paste also called thermal compound thermal grease thermal interface material tim thermal gel heat paste heat sink compound heat sink paste or cpu grease is a thermally conductive but usually electrically insulating chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices. In order to choose the correct heat sink for cooling electronic applications it s useful for engineers to understand the definitions uses and benefits of different types of heat sinks. Excellent heat transfer efficiency.

A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature. Silicone compound blended with thermally conductive fine metal oxide powders. Thermal joint compound for any device where efficient cooling is desired. Here are some guidelines for the types of heat sinks that are commonly used in conjunction with heat pipes and vapor chambers.

For mounting transistors diodes rectifiers and resistors. For effective transfer of heat between components heat sinks will not dry or harden white past. For mounting transistors diodes rectifiers and resistors. These compounds are commonly used with transistors diodes rectifiers and transformers.

For effective transfer of heat between components heat sinks will not dry or harden white paste. Applying thermal compound is a must because the contact surfaces are not perfectly even and smooth even brand new cpus and heat sinks have surface imperfections and microscopic scratches that traps pockets of air. Silicone base extra high efficiency heat transfer. Thermal joint compound for any device where efficient cooling is desired.

In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules. Zinc oxide compounds create a more secure bond than silicone compounds.